
| Parameter | Value |
|---|---|
| Length | 6 mm |
| Width | 6 mm |
| Termination | SMD/SMT |
| Max Operating Temperature | 125 °C |
| Min Operating Temperature | -40 °C |
| Number of Pins | 40 |
| Height | 830 µm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| Contact Plating | Tin |
| Core Architecture(core/core processor) | R-2R |
| Interface | Parallel |
| Min Input Voltage | -10 V |
| Operating Supply Voltage | 5 V |
| Max Power Dissipation | 50 µW |
| Max Supply Voltage | 5.5 V |
| Min Supply Voltage | 2.5 V |
| Power Dissipation | 50 µW |
| Number of Channels | 2 |
| Number of Bits | 12 |
| Number of DAC Channels | 2 |
| Max Input Voltage | 10 V |
| Reference Type | External |
| Sampling Rate | 21.3 Msps |
| Integral Nonlinearity (INL) | 1 LSB |
| Number of Converters | 2 |
| Settling Time | 80 ns |
| Nominal Supply Current | 500 nA |
| Resolution | 1.5 B |
| Number of D/A Converters | 2 |
| Conversion Rate | 21.3 Msps |
| Differential Output | Yes |
| Schedule B | 8542390000 |
| Max Digital Supply Voltage | 5.5 V |
| Min Digital Supply Voltage | 2.5 V |
| Interface Type(Data Interface) | Parallel |
| Analog Supply Voltage | 2.5 V to 5.5 V |
| Output Type | Current - Unbuffered |
| RoHS | Compliant |
| Packaging | Tray |
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